# EMC3090 FogCloud Module

#1. Introduction

  • EMC3090 FogCloud Module is an integrated hardware and firmware product launched by MXCHIP, used to quickly connect to the FogCloud platform.
  • It achieves high-speed connectivity through "no development" and "zero code" methods, greatly shortening the development and launch cycles of customers' complete products.
  • In addition, using the FogCloud platform independently developed by MXCHIP, the OTA of modules and the timeliness of upgrade iterations have been ensured to the greatest extent possible. The module image is as follows:

  • The module for this product is EMC3090-P, which is a Wi Fi+BLE Combo module with a working voltage of 3.3V and a working temperature of -20~85 ° C. The Cortex M33 core has a main frequency of up to 100MHz, 256K bytes of SRAM, 384K bytes of ROM, 2M bytes of XIP Flash, 2.4 GHz Wi Fi that meets IEEE 802.11 b/g/n standards, low-power Bluetooth that meets the BLE4.2 specification, and supports Bluetooth networking.

#2. Hardware Documents

  • Datasheet:

📎DS0169EN_EMC3090_V1.6.pdf

  • Certificaiton:

📎EMC3090-P_SRRC_证书.pdf

📎EMC3090-P_BQB_证书.pdf

📎EMC3090_RoHS_英文.pdf

📎EMC3090_REACH_英文.pdf

  • Reference Design:

📎EMC3090_REF_20221215.pdf

  • Reference design schematic and module packaging files:

📎EMC3090_REF_and_PCB_Package-PADS.zip

#3. Software Documents

#4. Development and Debugging

#5. QC Test Method

#6. Development Guideline


END.

Last Updated: 11/29/2023, 1:52:34 PM